Fermi FET transistor technology

Computer Engineering electronics Engineering Civil Engineering

Fermi-FET transistor technology can lead to significant improvement in circuit performance, layout density, power requirements, and manufacturing cost with only a moderate alteration of traditional MOSFET manufacturing technology. This technology makes use of a subtle optimization of traditional buried channel technology to overcome the known shortcomings of buried channel while maintaining large improvements in channel mobility. This technology merges the mobility and low drain current leakage of BCA devices as well as the higher short channel effect immunity of SCI devices. This paper highlights aspects of the technology in a non-mathematical presentation to give a sound general understanding of why the technology is the most promising avenue for advanced very short devices. Transistor scaling, a major driving force in the industry for decades, has been responsible for the dramatic increase in circuit complexity. Shorter gate lengths have required lower drain voltages and concurrently lower threshold voltages. Recent CMOS evolution has seen a dramatic reduction in operating voltage as transistor size is reduced. This was due to the maximum field limit on the gate oxide needed to maintain good long-term reliability. Proper selection of the gate material can produce low threshold transistors with off-state performance parameters equivalent to high threshold devices. The Buried Channel Accumulation device, currently being used for p-type transistor processes has the Fermi level at a considerable depth from the gate thereby making it difficult to shut the device off. Attempts to bring the Fermi level up result in severe degradation of device performance. Need for optimization of existing BCA technology arose and Thunderbird Technologies, Inc. delivered! The loading..