THERMAL SHOCK ON INTERFACIAL ADHESION OF THERMALLY CONDITIONED

Computer Engineering electronics Engineering Civil Engineering

The fiber/matrix adhesion is most likely to control the overall mechanical behavior of fiber-reinforced composites. An interfacial reaction may result in various morphological modifications to polymer matrix microstructure in proximity to the fiber surface. The interactions between fiber and polymer matrix during thermal conditioning and thermal shock are important phenomena. Thermal stresses were built-up in glass fiber reinforced epoxy composites by up-thermal shock cycles (negative to positive temperature exposure) for different durations and also by down-thermal shock cycles (positive to negative temperature exposure). The concentration of thermal stresses often results in weaker fiber/matrix interface. A degradative effect was observed in both modes for short shock cycles and thereafter, an improvement in shear strength was measured. The effects were shown in two different crosshead speeds during short-beam shear test. loading..