Computer Engineeringelectronics Engineering Civil Engineering |
|
Title- Laser interferometric studies of solder joints of surface mounted chips In order to understand the stress-strain relationship in surface mount solder joints. previous research workers used strain gauges to measure the deformation of these joints. However, this method is indirect and not very accurate. In this Ph.D. project, a non-contact and highly accurate method |
|
No comments:
Post a Comment